Jon Aday
9Patents
5h-index
30Co-inventors
63Inventor score
Filing activity: Apr 8, 1998 → Feb 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5969461A | Surface acoustic wave device package and method | Emerging Cross-Sectional Technologies | 133 | Expired |
| US8017436B1 | Thin substrate fabrication method and structure | Electricity | 24 | Active |
| US9679855B1 | Polymer crack stop seal ring structure in wafer level package | Electricity | 12 | Active |
| US6494361B1 | Semiconductor module package substrate fabrication method | Electricity | 8 | Expired |
| US6445075B1 | Semiconductor module package substrate | Electricity | 8 | Expired |
| US11003884B2 | Fingerprint sensor device and methods thereof | Electricity | 3 | Active |
| US12296333B2 | Hybrid glass plastic flow cell and fabrication methods | Physics | 0 | Active |
| US10516092B2 | Interface substrate and method of making the same | Electricity | 0 | Active |
| US12009352B2 | Fabricating wafers with electrical contacts on a surface parallel to an active surface | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.