Patent · US Active

Robot arm device and method for transferring wafer

US11004713B2 · kind B2 · utility

3Cited by

7References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Wei-Hua Houng · Hsinchu, TW
Che-Fu Chen · Hsinchu, TW

Key dates

Filing date	May 16, 2019
Grant date	May 11, 2021
Priority date	—
Expiry date	May 16, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01N2291/2697
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Heights of wafers in a front opening unified pod are identified by using an end effector and a front sensor arranged thereon, such that the end effector can be positioned at the appropriate height when retrieving one of the wafers, so as to avoid colliding with a wafer stored inside the front opening unified pod. Wafer backside properties can also be detected by the end effector, so as to report defects and contaminants on the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.