Bonded structures
US11004757B2 · kind B2 · utility
100Cited by
101References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Dec 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonded structure is disclosed. The bonded structure includes a first element and a second element that is bonded to the first element along a bonding interface. The bonding interface has an elongate conductive interface feature and a nonconductive interface feature. The bonded structure also includes an integrated device that is coupled to or formed with the first element or the second element. The elongate conductive interface feature has a recess through a portion of a thickness of the elongate conductive interface feature. A portion of the nonconductive interface feature is disposed in the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.