Package with different types of semiconductor dies attached to a flange
US11004808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2018 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | May 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material, a second semiconductor die attached to the same thermally conductive flange as the first semiconductor die via a second die attach material, and leads attached to the thermally conductive flange or to an insulating member secured to the flange. The leads are configured to provide external electrical access to the first and second semiconductor dies. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. Additional multi-die package embodiments are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.