Patent · US Active

Method for producing a semiconductor chip and semiconductor chip

US11004876B2 · kind B2 · utility

2Cited by
8References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 31, 2019
Grant dateMay 11, 2021
Priority date
Expiry dateJul 31, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/815
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing a semiconductor chip (100) is provided, in which, during a growth process for growing a first semiconductor layer (1), an inhomogeneous lateral temperature distribution is created along at least one direction of extent of the growing first semiconductor layer (1), such that a lateral variation of a material composition of the first semiconductor layer (1) is produced. A semiconductor chip (100) is additionally provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.