Method for manufacturing copper foil with rough surface in plating tank and its product
US11008665B2 · kind B2 · utility
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1References
3Claims
0Family size
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Key dates
| Filing date | May 30, 2019 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Aug 27, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.