Wei-Ping Dow
5Patents
1h-index
14Co-inventors
40Inventor score
Filing activity: Aug 4, 2014 → Sep 19, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9105696B1 | Method of coating surface of substrate hole with layer of reduced graphene oxide | Electricity | 9 | Active |
| US10543510B2 | Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO | Chemistry; Metallurgy | 0 | Active |
| US10465056B2 | Method for producing flexible conductive substrate with high transmittance and product thereof | Electricity | 0 | Active |
| US11008665B2 | Method for manufacturing copper foil with rough surface in plating tank and its product | Emerging Cross-Sectional Technologies | 0 | Active |
| US11252816B2 | Composite with hollow nano-structures and application thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.