Transport container automatic clamping mechanism
US11011403B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 7, 2018 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Aug 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.