Apparatus and method inspecting bonded semiconductor dice
US11011435B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2018 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Dec 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83908
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.