Lap Kei Chow
15Patents
3h-index
19Co-inventors
53Inventor score
Filing activity: Jun 26, 2001 → Nov 20, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6806725B2 | Method and apparatus for processing an array of packaged semiconductor devices | Electricity | 17 | Expired |
| US6967475B2 | Device transfer mechanism for a test handler | Physics | 8 | Expired |
| US7495759B1 | Damage and wear detection for rotary cutting blades | Physics | 5 | Active |
| US8167524B2 | Handling system for inspecting and sorting electronic components | Electricity | 3 | Active |
| US6783316B2 | Apparatus and method for testing semiconductor devices | Physics | 1 | Expired |
| US8289388B2 | Alignment method for singulation system | Electricity | 1 | Active |
| US8354612B2 | Laser processing apparatus | Performing Operations; Transporting | 0 | Active |
| US8538576B2 | Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece | Performing Operations; Transporting | 0 | Active |
| US7849847B2 | Drainage apparatus for a singulation system | Emerging Cross-Sectional Technologies | 0 | Active |
| US8167523B2 | Singulation handler comprising vision system | Emerging Cross-Sectional Technologies | 0 | Active |
| US8709916B2 | Laser processing method and apparatus | Performing Operations; Transporting | 0 | Active |
| US8702017B2 | Nozzle device employing high frequency wave energy | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US7486092B2 | Apparatus for supporting semiconductor devices during testing | Physics | 0 | Expired |
| US9016675B2 | Apparatus and method for supporting a workpiece during processing | Emerging Cross-Sectional Technologies | 0 | Active |
| US11011435B2 | Apparatus and method inspecting bonded semiconductor dice | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.