Bonding pad on a back side illuminated image sensor
US11011566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2016 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Sep 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonding pad structure comprises an interconnect layer, an isolation layer over the interconnect layer, a conductive pad, and one or more non-conducting stress-releasing structures. The conductive pad comprises a planar portion over the isolation layer, and one or more bridging portions extending through at least the isolation layer and to the interconnect layer for establishing electric contact therewith, wherein there is a trench in the one or more bridging portions. The one or more non-conducting stress-releasing structures are disposed between the isolation layer and the conductive pad. The trench is surrounded by one of the one or more non-conducting stress-releasing structures from a top view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.