Base material for printed circuit board and printed circuit board
US11013113B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Sep 24, 2018 |
| Grant date | May 18, 2021 |
| Priority date | — |
| Expiry date | Sep 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.