Curable resin including nanoparticles including surface-bonded hydrophobically-modifying alkyl groups
US11015040B2 · kind B2 · utility
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4References
14Claims
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Key dates
| Filing date | Oct 17, 2017 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Feb 12, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/011
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Various embodiments disclosed relate to a resin including nanoparticles including surface-bonded hydrophobically-modifying alkyl groups. The present invention provides a resin component that includes a curable resin. The resin component also includes nanoparticles dispersed in the resin. The nanoparticles each independently include surface-bonded hydrophobically-modifying (C1-C50)hydrocarbyl groups. At least one of the (C1-C50)hydrocarbyl groups is a (C1-C50)alkyl group and at least one of the surface-bonded hydrophobically-modifying (C1-C50)hydrocarbyl groups is a (C6-C50)aryl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.