Inventor · Windom, MN, US

Steven C. Hackett

10Patents
7h-index
16Co-inventors
63Inventor score

Filing activity: Jun 28, 1993 → Oct 17, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US5369192A Binder resin for resin transfer molding preforms Emerging Cross-Sectional Technologies 46 Expired
US6007917A Prepregs of curable epoxy resin compositions with 9,9-Bis (4-aminophenyl) fluorenes as curatives Emerging Cross-Sectional Technologies 32 Expired
US7327039B2 Nanoparticle filled underfill Electricity 26 Expired
US5728755A Curable epoxy resin compositions with 9,9'-bis(4-aminophenyl)fluorenes as curatives Emerging Cross-Sectional Technologies 15 Expired
US5432010A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms Emerging Cross-Sectional Technologies 12 Expired
US7482201B2 Nanoparticle filled underfill Electricity 11 Active
US6054221A Curable epoxy resin compositions, on release liners with 9,9-bis4-aminophenyl) fluorenes as curatives Emerging Cross-Sectional Technologies 10 Expired
US9221970B2 Nanocalcite composites Chemistry; Metallurgy 7 Active
US8487019B2 Filled resins and method for making filled resins Chemistry; Metallurgy 4 Active
US11015040B2 Curable resin including nanoparticles including surface-bonded hydrophobically-modifying alkyl groups Chemistry; Metallurgy 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.