Substrate holder and plating apparatus
US11015261B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2017 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.