Interface-free thermal management system for high power devices co-fabricated with electronic circuit
US11015879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2018 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Feb 5, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.