Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
US11018102B2 · kind B2 · utility
0Cited by
8References
20Claims
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Key dates
| Filing date | Sep 6, 2019 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Sep 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06513
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.