Inventor · Porto, PT

Bora Baloglu

30Patents
5h-index
22Co-inventors
65Inventor score

Filing activity: Apr 20, 2012 → Feb 8, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8986806B1 Warpage control stiffener ring package and fabrication method Electricity 16 Active
US9559075B1 Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Electricity 11 Active
US10410999B2 Semiconductor device with integrated heat distribution and manufacturing method thereof Electricity 8 Active
US9607890B1 Stress relieving through-silicon vias Electricity 6 Active
US9905440B1 Method of manufacturing an electronic device and electronic device manufactured thereby Electricity 6 Active
US10504827B2 Semiconductor device and manufacturing method thereof Electricity 2 Active
US9349613B1 Electronic package with embedded materials in a molded structure to control warpage and stress Electricity 2 Active
US10468272B2 Method of manufacturing an electronic device and electronic device manufactured thereby Electricity 2 Active
US11031259B2 Method of manufacturing an electronic device and electronic device manufactured thereby Electricity 1 Active
US10438910B2 Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Electricity 1 Active
US9269872B1 Molded electronic package geometry to control warpage and die stress Electricity 1 Active
US9741617B2 Encapsulated semiconductor package and method of manufacturing thereof Electricity 1 Active
US10032726B1 Embedded vibration management system Electricity 1 Active
US11915949B2 Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby Electricity 0 Active
US11352252B2 Semiconductor device and method of manufacturing semiconductor device Electricity 0 Active
US11901343B2 Semiconductor device with integrated heat distribution and manufacturing method thereof Electricity 0 Active
US11784101B2 Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure Electricity 0 Active
US10861798B2 Embedded vibration management system having an array of vibration absorbing structures Electricity 0 Active
US10062611B2 Encapsulated semiconductor package and method of manufacturing thereof Electricity 0 Active
US11444013B2 Semiconductor device and manufacturing method thereof Electricity 0 Active
US11605552B2 Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby Electricity 0 Active
US10134635B1 Stress relieving through-silicon vias Electricity 0 Active
US11018102B2 Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Electricity 0 Active
US10985146B2 Semiconductor device with integrated heat distribution and manufacturing method thereof Electricity 0 Active
US11897761B2 Semiconductor device and method of manufacturing semiconductor device Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.