Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component
US11021572B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jul 25, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Jul 25, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/085
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.