Patent assignee · JP · COMPANY

HD Microsystems, Ltd.

9Patents
9Active
9Granted
43Portfolio score

Filing activity: Jan 22, 2016 → Aug 12, 2020

Most-cited patents

PatentTitleAreaCited byStatus
US11487201B2 Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component Physics 1 Active
US11226560B2 Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component Electricity 1 Active
US11807721B2 Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component Physics 0 Active
US11021572B2 Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component Physics 0 Active
US11048167B2 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component Chemistry; Metallurgy 0 Active
US11592744B2 Positive-type photosensitive resin composition Physics 0 Active
US12386257B2 Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component Physics 0 Active
US12386256B2 Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component Electricity 0 Active
US11592743B2 Positive-type photosensitive resin composition Physics 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.