Lithographic apparatus adjustment method
US11022895B2 · kind B2 · utility
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1References
16Claims
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Key dates
| Filing date | Aug 14, 2018 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Aug 14, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/706
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method comprising determining aberrations caused by each lithographic apparatus of a set of lithographic apparatuses, calculating adjustments of the lithographic apparatuses which minimize differences between the aberrations caused by each of the lithographic apparatuses, and applying the adjustments to the lithographic apparatuses, providing better matching between the aberrations of patterns projected by the lithographic apparatuses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.