Patent · US Active

Direct selective adhesion promotor plating

US11024565B2 · kind B2 · utility

0Cited by

11References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Jochen Dangelmaier · Beratzhausen, DE
Kim Huat Hoa · Melaka City, MY
Hazrul Alang Abd Hamid · Kuala Pilah, MY
Andreas Allmeier · Pfatter, DE
Dietmar Lang · Regenstauf, DE

Key dates

Filing date	Apr 12, 2019
Grant date	Jun 1, 2021
Priority date	—
Expiry date	Jun 14, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.