Structures and methods for electrical connection of micro-devices and substrates

US11024608B2 · kind B2 · utility

Assignee

• X Display Company Technology Limited · IE

Inventors

• Matthew Meitl · Durham, US
• Brook Raymond · Cary, US
• Ronald S. Cok · Rochester, US
• Christopher Bower · Raleigh, US
• Salvatore Bonafede · Chapel Hill, US
• Erich Radauscher · Raleigh, US
• Carl Prevatte · Raleigh, US
• António José Marques Trindade · Cork, IE
• Tanya Yvette Moore · Hurdle Mills, US

Key dates

• Filing date: Jul 18, 2018
• Grant date: Jun 1, 2021
• Expiry date: Feb 24, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.