System-level camera module with electrical support and manufacturing method thereof
US11025805B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Jun 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.