Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrate
US11028340B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Feb 19, 2018 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Feb 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An objective of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, and an amino group, and water, in which pH is less than 7, and the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.