Method for producing porous copper foil and porous copper foil produced by the same
US11028495B2 · kind B2 · utility
0Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2018 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Jun 6, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.