YMT CO., LTD.
6Patents
6Active
6Granted
43Portfolio score
Filing activity: Sep 22, 2008 → Dec 10, 2021 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9758889B2 | Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby | Emerging Cross-Sectional Technologies | 4 | Active |
| US11028495B2 | Method for producing porous copper foil and porous copper foil produced by the same | Chemistry; Metallurgy | 0 | Active |
| US12408279B2 | Release layer for metal foil with carrier and metal foil comprising the same | Electricity | 0 | Active |
| US7981317B2 | Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same | Electricity | 0 | Active |
| US12139811B2 | Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same | Electricity | 0 | Active |
| US11499233B2 | Plated laminate and printed circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.