Apparatus for measuring wafer
US11029256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Apr 13, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9505
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.