Method of manufacturing an electronic device and electronic device manufactured thereby
US11031259B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Nov 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.