Semiconductor device including high speed heterogeneous integrated controller and cache
US11031378B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 13, 2020 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Mar 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including a controller die and a memory module. The controller die may be a heterogeneous integrated controller die having ASIC logic circuits, memory array logic circuits and a cache structure. In examples, the memory module may have continuously formed through silicon vias in a face-up or face-down configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.