Zengyu Zhou
8Patents
2h-index
26Co-inventors
43Inventor score
Filing activity: Jun 12, 2017 → Mar 7, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10177119B2 | Fan out semiconductor device including a plurality of semiconductor die | Electricity | 5 | Active |
| US10236276B2 | Semiconductor device including vertically integrated groups of semiconductor packages | Electricity | 3 | Active |
| US11031378B2 | Semiconductor device including high speed heterogeneous integrated controller and cache | Electricity | 0 | Active |
| US11784135B2 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Electricity | 0 | Active |
| US12021061B2 | Packaged memory device with flip chip and wire bond dies | Electricity | 0 | Active |
| US11810896B2 | Substrate component layout and bonding method for increased package capacity | Electricity | 0 | Active |
| US12021060B2 | Reducing keep-out-zone area for a semiconductor device | Electricity | 0 | Active |
| US11917761B2 | Tombstone prevention for a surface mount device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.