Package integrated waveguide
US11031681B2 · kind B2 · utility
3Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Nov 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.