Planarization process, apparatus and method of manufacturing an article
US11034057B2 · kind B2 · utility
0Cited by
6References
22Claims
0Family size
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Key dates
| Filing date | Aug 15, 2019 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Aug 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31058
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method is provided, comprising creating at least one crack at a point on an edge of a stack of at least a substrate and a superstrate; propagating the crack along the periphery; and moving the superstrate relative to the substrate to complete separation of the superstrate from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.