Thermal conductive member and heat dissipation structure including the same
US11034623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Mar 28, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/588
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.