Methods of separating one or more substrates that are adhesively bonded to a carrier, and related systems and apparatuses
US11037593B1 · kind B1 · utility
0Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2019 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/502
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to separating parts (e.g., sliders and/or row bars) from an adhesive and carrier during the manufacture of parts to be used in a data storage device such as a hard disc drive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.