Patent · US Active

Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus

US11037855B2 · kind B2 · utility

0Cited by

0References

11Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Sonja Koller · Regensburg, DE
Reinhard Mahnkopf · Oberhaching, DE

Key dates

Filing date	Dec 30, 2016
Grant date	Jun 15, 2021
Priority date	—
Expiry date	Dec 30, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16195
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-in-package apparatus includes a contoured heat sink that provides a first recess and a subsequent recess. The system-in-package apparatus includes a flexible printed wiring board that is wrapped onto the contoured heat sink after a manner to enclose the first semiconductive device into the first recess and a semiconductive device in the subsequent recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.