Inventor · Regensburg, DE

Sonja Koller

25Patents
1h-index
22Co-inventors
49Inventor score

Filing activity: Feb 25, 2014 → Sep 27, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9368461B2 Contact pads for integrated circuit packages Electricity 3 Active
US11784143B2 Single metal cavity antenna in package connected to an integrated transceiver front-end Electricity 1 Active
US11646498B2 Package integrated cavity resonator antenna Electricity 1 Active
US11134573B2 Printed wiring-board islands for connecting chip packages and methods of assembling same Emerging Cross-Sectional Technologies 1 Active
US9397019B2 Integrated circuit package configurations to reduce stiffness Electricity 1 Active
US10263106B2 Power mesh-on-die trace bumping Electricity 1 Active
US10629731B2 Power mesh-on-die trace bumping Electricity 0 Active
US10091866B2 Device with switchable heat path Electricity 0 Active
US10535578B2 Semiconductor devices, and a method for forming a semiconductor device Electricity 0 Active
US11410908B2 Integrated circuit devices with front-end metal structures Electricity 0 Active
US10347558B2 Low thermal resistance hanging die package Electricity 0 Active
US10658201B2 Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device Electricity 0 Active
US11037855B2 Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus Electricity 0 Active
US9653324B2 Integrated circuit package configurations to reduce stiffness Electricity 0 Active
US11374323B2 Patch antennas stitched to systems in packages and methods of assembling same Electricity 0 Active
US10373844B2 Integrated circuit package configurations to reduce stiffness Electricity 0 Active
US9921694B2 Wearable computing device Physics 0 Active
US10651102B2 Interposer with conductive routing exposed on sidewalls Electricity 0 Active
US10121726B2 Cooler for semiconductor devices Electricity 0 Active
US11456116B2 Magnetic coils in locally thinned silicon bridges and methods of assembling same Emerging Cross-Sectional Technologies 0 Active
US9299672B2 Contact pads for integrated circuit packages General 0 Revoked
US11877403B2 Printed wiring-board islands for connecting chip packages and methods of assembling same Emerging Cross-Sectional Technologies 0 Active
US12249553B2 Thermal contacts at periphery of integrated circuit packages Electricity 0 Active
US11145577B2 Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus Electricity 0 Active
US11764187B2 Semiconductor packages, and methods for forming semiconductor packages Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.