Systems and methods for semiconductor chip hole geometry metrology
US11041814B1 · kind B1 · utility
3Cited by
3References
20Claims
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Key dates
| Filing date | Apr 30, 2020 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Apr 30, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95653
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of systems and methods for measuring a geometric attribute of a hole structure in a semiconductor chip are disclosed. In an example, an optical spectrum signal corresponding to the hole structure in the semiconductor chip is received. The optical spectrum signal is characterized by one or more optical features. The geometric attribute of the hole structure is determined based, at least in part, on the optical features using a model. The model is trained from a plurality of training samples each including a pair of an optical spectrum signal and a labeled reference signal both corresponding to a same hole structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.