Micro-roughened electrodeposited copper foil and copper foil substrate
US11047061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2019 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Nov 19, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of grooves and a plurality of micro-crystal clusters. Each of the grooves has a U-shaped or V-shaped cross-section profile, and the grooves have an average maximum width between 0.1 μm and 4 μm and an average depth less than or equal to 1.5 μm. Each of the micro-crystal clusters is composed of a plurality of micro-crystals each having an average diameter less than or equal to 0.5 μm grouped together. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.3. The micro-rough surface has good bonding strength relative to a substrate, and the copper foil substrate has good insertion loss performance to significantly reduce signal loss.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.