Chun-Yu Kao
8Patents
1h-index
6Co-inventors
36Inventor score
Filing activity: Sep 9, 2019 → Nov 3, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11047061B2 | Micro-roughened electrodeposited copper foil and copper foil substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US11053602B2 | Micro-roughened electrodeposited copper foil and copper foil substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US11408087B2 | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US12120816B2 | Micro-roughened electrodeposited copper foil and copper clad laminate | Electricity | 0 | Active |
| US11332839B2 | Advanced electrodeposited copper foil and copper clad laminate using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US12266529B2 | Patterning semiconductor devices and structures resulting therefrom | Electricity | 0 | Active |
| US11655555B2 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Electricity | 0 | Active |
| US11848209B2 | Patterning semiconductor devices and structures resulting therefrom | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.