Patent · US Active

Defect detection

US11047807B2 · kind B2 · utility

1Cited by
0References
23Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 25, 2020
Grant dateJun 29, 2021
Priority date—
Expiry dateMar 25, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06T2207/30148
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

There may be provided a method for determining three dimensional (3D) defect information, the method may include performing a two-dimensional (2D) inspection of an area of a wafer to generate 2D defect information related to defects of the area of the wafer; estimating 3D defect information regarding the defects of the area of the wafer, wherein the estimating is based on the 2D defect information related to defects of the area of the wafer, and a mapping between 2D defect information and 3D defect information, wherein the mapping is generated using a supervised deep learning machine process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.