Projection exposure apparatus for semiconductor lithography with improved component adjustment and adjustment method
US11048177B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 6, 2020 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Jul 6, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A projection exposure apparatus for semiconductor lithography includes a component and fixed to a structural part of the apparatus. The component and/or the structural part have/has a stop for bearing against a reference surface at the structural part and/or the component. The stop is movable relative to the component fixed and/or the structural part so that it can be moved away from the reference surface. A method for adjusting a component on a structural part of a projection exposure apparatus includes: securing a stop to the component or the structural part; positioning the component so that the stop comes into mechanical contact with a reference surface at the component or the structural part; fixing the component to the structural part; and moving the stop away from the reference surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.