MIMCAP creation and utilization methodology
US11049854B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2018 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Jan 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A metal-insulator-metal (MIM) capacitor design methodology and system substantially maximizes the benefits of including MIM capacitors in an integrated circuit design while substantially minimizing the negative impacts resulting from increased capacitance. A process analysis is performed on an integrated circuit design to determine a metal layer that is likely to be most adversely affected by the presence of MIM capacitor cells. The MIM capacitor cells are then designed to have specific sizes and orientations based on results of the process analysis, taking the most affected metal layer into consideration. Finally, the MIM capacitor cells are placed at selected locations on the die in an algorithmic fashion in order to satisfy a design target of maximizing coverage area while avoiding interference with signal paths and critical or sensitive components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.