Crimping apparatus and system for crimping a flexible printed circuit
US11050207B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2020 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Mar 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/0427
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.