Inventor · Taipei, TW

Shih-Ching Chen

35Patents
6h-index
63Co-inventors
72Inventor score

Filing activity: Jan 30, 1996 → Apr 14, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6354316B1 Skeleton for umbrella tent Fixed Constructions 31 Expired
US6802329B2 Top setting-up mechanism for folding tent Fixed Constructions 26 Expired
US6397433B1 Knuckle assembly Emerging Cross-Sectional Technologies 14 Expired
US6238996A Method of forming a shallow trench isolation structure Electricity 11 Expired
US9754868B2 Substrate structure, electronic package and method for fabricating the electronic package Electricity 7 Active
US6121109A Method of forming hemispherical grain polysilicon over lower electrode capacitor Electricity 7 Expired
US6171955A Method for forming hemispherical grained silicon structure Electricity 6 Expired
US5658833A Method and dummy disc for uniformly depositing silicon nitride Chemistry; Metallurgy 5 Expired
US6187630A Method for forming hemispherical silicon grains on designated areas of silicon layer Electricity 3 Expired
US9875949B2 Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof Electricity 3 Active
US8427879B2 Method for enabling a SONOS transistor to be used as both a switch and a memory Electricity 2 Active
US10543367B2 Transcranial burst electrostimulation apparatus and its applications Human Necessities 2 Active
US8592794B2 Resistance random access memory element and method for making the same Electricity 1 Active
US11353996B2 Touch-sensing cover and manufacturing method thereof Performing Operations; Transporting 1 Active
US6239040A Method of coating amorphous silicon film Electricity 1 Expired
US7835192B2 Method for programming a nonvolatile memory Physics 1 Active
US9601403B2 Electronic package and fabrication method thereof Electricity 1 Active
US8907228B2 Circuit structure of electronic device and its manufacturing method Emerging Cross-Sectional Technologies 0 Active
US9899309B2 Electronic package and semiconductor substrate Electricity 0 Active
US11050207B2 Crimping apparatus and system for crimping a flexible printed circuit Electricity 0 Active
US10461002B2 Fabrication method of electronic module Emerging Cross-Sectional Technologies 0 Active
US11513638B2 Silver nanowire protection layer structure and manufacturing method thereof Electricity 0 Active
US10242972B2 Package structure and fabrication method thereof Electricity 0 Active
US10096541B2 Method for fabricating electronic package Electricity 0 Active
US9607974B2 Package structure and fabrication method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.