Patent · US Active

Nozzle for uniform plasma processing

US11053590B2 · kind B2 · utility

2Cited by
45References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 26, 2019
Grant dateJul 6, 2021
Priority date
Expiry dateDec 29, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/3244
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.