Micro-roughened electrodeposited copper foil and copper foil substrate
US11053602B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Nov 8, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters. Each of the V-shaped grooves is defined by adjacent two of the peaks and has an average depth less than 1 μm. The micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 μm. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.