Thickness measurement method, thickness measurement device, defect detection method, and defect detection device
US11054252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Sep 20, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30108
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Method for measuring a depth of a defect inside an inspection object is provided. The method comprises steps of: generating thermal image data corresponding to a temperature of a surface of the inspection object by photographing a heated surface of the inspection object at a predetermined time interval by a photographing device; obtaining a temperature curve showing a temporal change in temperature of the surface of the inspection object based on the thermal image data; fitting a theoretical equation obtained from a heat conduction equation including a parameter related to the depth of the defect of the inspection object to the temperature curve to obtain a theoretical curve showing a temporal change in temperature of the surface of the inspection object; and obtaining the depth of the defect of the inspection object based on a value of the parameter in the theoretical equation corresponding to the theoretical curve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.