Soft error inspection method, soft error inspection apparatus, and soft error inspection system
US11054460B2 · kind B2 · utility
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1References
9Claims
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Key dates
| Filing date | Nov 14, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Dec 14, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A soft error inspection method for a semiconductor device includes: irradiating and scanning the semiconductor device with a laser beam or an electron beam; and measuring and storing a time of bit inversion for each of areas irradiated with the laser beam or the electron beam of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.