Package structure for power converter and manufacture method thereof
US11056421B2 · kind B2 · utility
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2References
12Claims
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Assignee
Inventor
Key dates
| Filing date | Aug 23, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Dec 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure of a power converter, can include: a die pad; an insulation adhesive layer and a conductive adhesive layer on the die pad; a control circuit die on the insulation adhesive layer, where the insulation adhesive layer comprises a first insulation adhesive layer on a back surface of the control circuit die, and a second insulation adhesive on a surface of the die pad, where the first insulation adhesive layer is connected to the second insulation adhesive layer; and a power device die on the conductive adhesive layer, where the insulation adhesive layer is separated from the conductive adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.